Void-free using SRO-702 ATV chamber to achieve void-free solder joints for optimum heat transfer from high power MMIC devices; can also be used for flux-free solder assembly of large-area components such as substrate and heat spreader attachment to carriers; manual soldering with solder iron and/or hotplate and re-flow solder equipment
Contact - Chris Bee, Christopher.Bee@honeywell.com
